Lead frames that are in cassettes can be very tiny and difficult to detect. A sensor is needed that can accurately identify the lead frames.
In the process of die bonding and wire bonding, lead frames are conveyed in a tall vertical cassette. To increase throughput, the cassettes are inspected to determine if a lead frame is present in each slot. Because the lead frame can be as thin as 0.1 mm, it can be difficult to sense.
The VS1 convergent sensor easily senses this thin profile, as well as non-reflective plastic ball grid arrays (PBGA).
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